半导体用陶瓷绝缘基板成型方法研究

陶瓷材料是半导体器件,特别是大功率半导体器件绝缘基板的重要材料体系。随着半导体器件向大功率化、高频化的不断发展,对陶瓷绝缘基片的导热性和力学性能都提出了更高的要求。成型是陶瓷基板的制备过程的关键环节,也是陶瓷基板制备的难点。本文介绍了流延成型、凝胶注模成型和新型3D打印成型等几种基板成型方法,分析了不同成型方法的特点、优势及技术难点。介绍了了近年来国内外陶瓷基板成型的研究现状,并对其未来发展及应用进行了展望。

Study on Forming Methods of Ceramic Insulating Substrate for Semiconductor

Ceramic is an important material system for semiconductor devices,especially for high power semiconductor devices.With the continuous development of semiconductor devices to high-power and highfrequency,higher requirements are put forward for thermal conductivity and mechanical properties of ceramic insulating substrates.Molding is the key link and the difficulty in the preparation process of ceramic substrate.This paper introduces several substrate forming methods including tape casting,gel casting and new-type 3D printing,and also analyzes the characteristics,advantages and technical difficulties of different forming methods.The domestic and overseas research status of ceramic substrate in recent years is introduced,and the future development and application are prospected.