| 刚挠结合板孔内金属化工艺探讨 |
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| 引用本文： | 朱贤佳.刚挠结合板孔内金属化工艺探讨[J].印制电路信息,2010(Z1):133-136. |
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| 作者姓名： | 朱贤佳 |
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| 作者单位： | 佛山市成德电路股份有限公司 |
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| 摘 要： | 文章对刚挠结合板孔内金属化制作工艺进行探讨,分别对钻孔、去钻污及化学沉镀铜工艺进行陈述,利用实验分析钻孔作业参数对刚挠结合板孔内金属化的重要性,在现有制程条件下以实现刚挠结合板孔内金属化的质量要求。
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| 关 键 词： | 刚挠结合板 孔内金属化 |
Rigid-flex PCB hole plating metallization process |
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| ZHU Xian-jia.Rigid-flex PCB hole plating metallization process[J].Printed Circuit Information,2010(Z1):133-136. |
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| Authors: | ZHU Xian-jia |
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| Affiliation: | ZHU Xian-jia |
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| Abstract: | This file described the investigation about plated through hole process for rigid-flex PCB. It explained three related processes: drilling, deburring and plating through. To achieve excellent quality at plated through hole for rigid-flex boards, experimental analysis about the importance of drilling parameters for the plated through hole for rigid-flex boards is made. |
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| Keywords: | Rigid-flex pcb Plated through hole |
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