| 双根锥形硅通孔结构的精确RLGC电路模型 |
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| 引用本文： | 魏祯,李晓春,毛军发.双根锥形硅通孔结构的精确RLGC电路模型[J].半导体学报,2014,35(9):095008-7. |
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| 作者姓名： | 魏祯 李晓春 毛军发 |
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| 摘 要： | A fast RLGC circuit model with analytical expression is proposed for the dual tapered through-silicon via （TSV） structure in three-dimensional integrated circuits under different slope angles at the wide frequency region. By describing the electrical characteristics of the dual tapered TSV structure, the RLGC parameters are extracted based on the numerical integration method. The RLGC model includes metal resistance, metal inductance, substrate resistance, outer inductance with skin effect and eddy effect taken into account. The proposed analytical model is verified to be nearly as accurate as the Q3D extractor but more efficient.
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| 关 键 词： | 电路模型 TSV 双锥形 结构 三维集成电路 数值积分方法 金属电阻 解析表达式 |
An accurate RLGC circuit model for dual tapered TSV structure |
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| Wei Zhen,Li Xiaochun and Mao Junfa.An accurate RLGC circuit model for dual tapered TSV structure[J].Chinese Journal of Semiconductors,2014,35(9):095008-7. |
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| Authors: | Wei Zhen Li Xiaochun and Mao Junfa |
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| Affiliation: | Key Laboratory of Ministry of Education of Design and Electromagnetic Compatibility of High-Speed Electronic Systems, Shanghai Jiao Tong University, Shanghai 200240, China;Key Laboratory of Ministry of Education of Design and Electromagnetic Compatibility of High-Speed Electronic Systems, Shanghai Jiao Tong University, Shanghai 200240, China;Key Laboratory of Ministry of Education of Design and Electromagnetic Compatibility of High-Speed Electronic Systems, Shanghai Jiao Tong University, Shanghai 200240, China |
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| Abstract: | A fast RLGC circuit model with analytical expression is proposed for the dual tapered through-silicon via (TSV) structure in three-dimensional integrated circuits under different slope angles at the wide frequency region. By describing the electrical characteristics of the dual tapered TSV structure, the RLGC parameters are extracted based on the numerical integration method. The RLGC model includes metal resistance, metal inductance, substrate resistance, outer inductance with skin effect and eddy effect taken into account. The proposed analytical model is verified to be nearly as accurate as the Q3D extractor but more efficient. |
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| Keywords: | tapered TSV RLGC circuit model numerical integration method current continuity eddy effect |
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