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SMT焊点形态成形和焊点可靠性CAD
引用本文:周德俭,潘开林,刘常康.SMT焊点形态成形和焊点可靠性CAD[J].半导体学报,2000,21(2):204-0.
作者姓名:周德俭  潘开林  刘常康
作者单位:桂林电子工业学院!桂林541004
摘    要:以PBGA焊点形态成形CAD和焊点热疲劳寿命可靠性CAD研究为例,提出SMT焊点形态成形和可靠性一体化设计思想,并对其实现方法进行了分析研究,给出了具体实现步骤和研究结果.

关 键 词:表面组装技术    焊点    计算机辅助设计
文章编号:0253-4177(2000)02-0204-05
修稿时间:1998年8月21日

Solder Joint Shape Evolving and Reliability CAD of SMT Solder Joint
ZHOU De\|jian,PAN Kai\|lin and LIU Chang\|kang.Solder Joint Shape Evolving and Reliability CAD of SMT Solder Joint[J].Chinese Journal of Semiconductors,2000,21(2):204-0.
Authors:ZHOU De\|jian  PAN Kai\|lin and LIU Chang\|kang
Abstract:PBGA solder joint is taken as example for CAD study of solder joint evolving and thermal fatigue life,integration design thought of solder evolving and reliability is presented.After realization method is analyzed,realization process in detail is provided and results are shown.
Keywords:SMT  Solder Joint  CAD
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