用模拟退火算法实现集成电路热布局优化

介绍了一种综合考虑集成电路电学性能指标以及热效应影响的布局优化方法 .在保证传统设计目标 (如芯片面积、连线长度、延迟等 )不被恶化的基础上 ,通过降低或消除芯片上的热点来优化集成电路芯片的温度分布情况 ,进而优化整个电路性能 .并将改进的模拟退火算法应用于集成电路的热布局优化 ,模拟结果表明该方法与传统布局方法相比在保持了较好的延迟与连线长度等设计目标的同时 ,很好地改善了芯片表面的热分配情况

VLSI Thermal Placement Optimization Using Simulated Annealing

A placement scheme that considers both electrical performance requirements and thermal behavior for high performance VLSI chips is described.It is aimed at improving the substrate thermal distribution of a chip design without worsening the traditional design objects such as critical path delay and wire length very much.A useful placement method is developed using simulated annealing algorithm to optimize chip substrate thermal distribution.The simulation results show satisfied improvements of thermal distribution over the traditional placement algorithm with bearable increases of less than 4% in delay and total wire length of the final layout.