首页 | 本学科首页   官方微博 | 高级检索  
     

一种粒子探测器的CMOS读出电路设计
引用本文:张雅聪,陈中建,鲁文高,赵宝瑛,吉利久.一种粒子探测器的CMOS读出电路设计[J].半导体学报,2007,28(2):182-188.
作者姓名:张雅聪  陈中建  鲁文高  赵宝瑛  吉利久
作者单位:北京大学微电子研究院,北京,100871;北京大学微电子研究院,北京,100871;北京大学微电子研究院,北京,100871;北京大学微电子研究院,北京,100871;北京大学微电子研究院,北京,100871
摘    要:提出了新型的应用于粒子探测器CMOS读出电路中的电荷灵敏放大器和CR-(RC)n半高斯整形器的结构.电荷灵敏放大器采用多晶硅电阻做反馈来减小噪声,仿真发现与传统结构相比,在探测器电容高达150pF时,输入等效噪声电荷数由5036个电子减小到2381个,代价是输出摆幅减小了0.5V.在整形器中,MOS管电阻与多晶硅电阻串联,通过调节MOS管的栅压来改变阻值,以补偿工艺的偏差,在不明显降低线性度的情况下保证了时间常数能够比较精确控制.

关 键 词:电荷灵敏放大器  整形器  读出电路  噪声优化
文章编号:0253-4177(2007)02-0182-07
收稿时间:7/19/2006 1:25:14 PM
修稿时间:8/31/2006 8:50:10 PM

A Fully Integrated CMOS Readout Circuit for Particle Detectors
Zhang Yacong,Chen Zhongjian,Lu Wengao,Zhao Baoying and Ji Lijiu.A Fully Integrated CMOS Readout Circuit for Particle Detectors[J].Chinese Journal of Semiconductors,2007,28(2):182-188.
Authors:Zhang Yacong  Chen Zhongjian  Lu Wengao  Zhao Baoying and Ji Lijiu
Affiliation:Institute of Microelectronics,Peking University,Beijing 100871,China;Institute of Microelectronics,Peking University,Beijing 100871,China;Institute of Microelectronics,Peking University,Beijing 100871,China;Institute of Microelectronics,Peking University,Beijing 100871,China;Institute of Microelectronics,Peking University,Beijing 100871,China
Abstract:Novel schemes for a charge sensitive amplifier (CSA) and a CR-(RC)n semi-Gaussian shaper in a fully integrated CMOS readout circuit for particle detectors are presented.The CSA is designed with poly-resistors as feedback components to reduce noise.Compared with conventional CSA,the input referred equivalent noise charge(ENC) is simulated to be reduced from 5036e to 2381e with a large detector capacitance of 150pF at the cost of 0.5V output swing loss.The CR-(RC)n semi-Gaussian shaper uses MOS transistors in the triode region in series with poly-resistors to compensate process variation without much linearity reduction.
Keywords:charge sensitive amplifier  shaper  readout circuit  noise optimization
本文献已被 CNKI 维普 万方数据 等数据库收录!
点击此处可从《半导体学报》浏览原始摘要信息
点击此处可从《半导体学报》下载全文
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号