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X波段GaN HEMT内匹配器件
引用本文:王勇,李静强,张志国,冯震,宋建博,冯志红,蔡树军,杨克武.X波段GaN HEMT内匹配器件[J].半导体学报,2008,29(9):1783-1785.
作者姓名:王勇  李静强  张志国  冯震  宋建博  冯志红  蔡树军  杨克武
作者单位:专用集成电路国家重点实验室,石家庄,050051;中国电了科技集团公司第十三研究所,石家庄,050051;专用集成电路国家重点实验室,石家庄,050051;中国电了科技集团公司第十三研究所,石家庄,050051;专用集成电路国家重点实验室,石家庄,050051;中国电了科技集团公司第十三研究所,石家庄,050051;专用集成电路国家重点实验室,石家庄,050051;中国电了科技集团公司第十三研究所,石家庄,050051;专用集成电路国家重点实验室,石家庄,050051;中国电了科技集团公司第十三研究所,石家庄,050051;专用集成电路国家重点实验室,石家庄,050051;中国电了科技集团公司第十三研究所,石家庄,050051;专用集成电路国家重点实验室,石家庄,050051;中国电了科技集团公司第十三研究所,石家庄,050051
基金项目:国家基础研究重大项目基金
摘    要:自主研制的GaN HEMT,栅源泄漏电流从1E-4A量级减小到了1E-6A量级,有效提高了栅漏击穿电压,改善了器件工作特性. 采用MIS结构制作了2.5mm栅宽GaN HEMT,测试频率为8GHz,漏源电压为33V时,器件连续波输出功率为18.2W,功率增益为7.6dB,峰值功率附加效率为43.0%. 2.5mm×4 GaN HEMT内匹配器件,测试频率8GHz,连续波输出功率64.5W,功率增益7.2dB,功率附加效率39%.

关 键 词:GaN  HEMT  内匹配  输出功率  功率增益  功率附加效率
收稿时间:3/13/2008 2:54:47 PM
修稿时间:5/5/2008 8:35:28 AM

X-Band Internally-Matched GaN HEMTs
Wang Yong,Li Jingqiang,Zhang Zhiguo,Feng Zhen,Song Jianbo,Feng Zhihong,Cai Shujun and Yang Kewu.X-Band Internally-Matched GaN HEMTs[J].Chinese Journal of Semiconductors,2008,29(9):1783-1785.
Authors:Wang Yong  Li Jingqiang  Zhang Zhiguo  Feng Zhen  Song Jianbo  Feng Zhihong  Cai Shujun and Yang Kewu
Affiliation:National Key Laboratory of ASIC,Shijiazhuang 050051,China;The 13th Research Institute,CETC,Shijiazhuang 050051,China;National Key Laboratory of ASIC,Shijiazhuang 050051,China;The 13th Research Institute,CETC,Shijiazhuang 050051,China;National Key Laboratory of ASIC,Shijiazhuang 050051,China;The 13th Research Institute,CETC,Shijiazhuang 050051,China;School of Microelectronics,Xidian University,Xi'an 710071,China;National Key Laboratory of ASIC,Shijiazhuang 050051,China;The 13th Research Institute,CETC,Shijiazhuang 050051,China;National Key Laboratory of ASIC,Shijiazhuang 050051,China;The 13th Research Institute,CETC,Shijiazhuang 050051,China;National Key Laboratory of ASIC,Shijiazhuang 050051,China;The 13th Research Institute,CETC,Shijiazhuang 050051,China;National Key Laboratory of ASIC,Shijiazhuang 050051,China;The 13th Research Institute,CETC,Shijiazhuang 050051,China;National Key Laboratory of ASIC,Shijiazhuang 050051,China;The 13th Research Institute,CETC,Shijiazhuang 050051,China
Abstract:With a self-developed GaN HEMT,the magnitude of leakage current between gate and drain is reduced to 1E-6A,the breakdown voltage is increased effectively,and the operating characteristic is improved.An MIS-GaN HEMT with 2.5mm gate-width is fabricated.When the operation voltage is 33V,the resultant device delivers a saturation output power of 18.2W,a power gain of 7.6dB,and a peak power added efficiency of 43.0% at a frequency of 8GHz CW.The internally-matched GaN HEMTs with a total gate-width of 2.5mm×4 deliver a saturation output power of 64.5W,a power gain of 7.2dB,and a power added efficiency of 39% at a frequency of 8GHz CW.
Keywords:GaN HEMT  internal matching  output power  power gain  power added efficiency
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