K波段小型化收发前端的研制

为了显著降低K波段雷达收发前端的尺寸，提高系统性能，研究了一种基于低阻硅埋置腔体和BCB/Au金属互连的毫米波系统级封装技术，采用两层BCB涂覆的方式改善了BCB覆盖不均的情况。制备的K波段雷达收发前端中包含压控振荡器、低噪声放大器、混频器及功分器，尺寸仅有6.4*5.4 mm2，测试结果显示，在22.5 GHz 到 22.9 GHz的频带内，发射功率大于11dBm，中频增益大于10dB, 发射端到中频输出端隔离度大于30dB，满足系统小型化、高性能的需求。

Development of a K-Band Miniaturized T/R Front-end

To significantly reduce the size of K-band radar transceiver and improve the system performance, a wafer-level millimeter wave system in package process based on embedded package structure and BCB/Au interconnection was present. The K-band radar transceiver system contained a voltage controlled oscillator, a mixer, a low noise amplifier embedded in a lossy-silicon wafer and a divider. The whole K-band radar front-end was implemented in 6.4*5.4 mm2. According to the measured results, the transmitted power was more than 11 dBm within the operating frequency range (22.5-22.9 GHz), IF gain was better than 10 dB and the isolation of LO-IF was more than 30 dB which met the requirement of system miniaturization.