| 混合封装电力电子集成模块内功率电路
对驱动保护电路的热影响 |
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| 引用本文： | 曾翔君,余小玲,王晓宝,杨旭,王兆安.混合封装电力电子集成模块内功率电路
对驱动保护电路的热影响[J].电子器件,2004,27(1):19-23. |
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| 作者姓名： | 曾翔君 余小玲 王晓宝 杨旭 王兆安 |
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| 作者单位： | 1. 西安交通大学电气工程学院
2. 西安电力电子研究所,西安,710049 |
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| 基金项目： | 国家自然科学基金“电子系统集成理论与若干关健技术的研究”(项目批准号:503237030) |
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| 摘 要： | 混合封装电力电子集成模块(IPEM)是目前中功率范围内电力电子集成的主要方式。IGBT器件与控制和驱动电路高密度地封装在一起，IGBT的发热对驱动保护电路会产生非常不利的影响，我们针对这个问题进行了研究。利用三维有限元法建立了模块内的传热模型，对不同发热功率下IGBT的结温以及驱动保护电路PCB的最高温度进行了计算和分析。另外，对功率电路与驱动保护电路PCB之间存在空气隙以及模块完全被密封后模块内的传热问题也进行了实验研究。
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| 关 键 词： | 电力电子集成模块 传热 3D有限元模型 |
| 文章编号： | 1005-9490(2004)01-0019-05 |
Power Circuit′s Thermal Effect to Drive/Protection Circuits inside Hybrid IPEM |
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| ZENG Xiang-jun,XU Yao-ling,WANG Xiao-bao,YANG Xu,WANG Zhao-an
. Electrical Engineering School,Xi' an Jiaotong University,
. Xi' an Power Electronic Research Institute, Xi' an ,China.Power Circuit′s Thermal Effect to Drive/Protection Circuits inside Hybrid IPEM[J].Journal of Electron Devices,2004,27(1):19-23. |
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| Authors: | ZENG Xiang-jun XU Yao-ling WANG Xiao-bao YANG Xu WANG Zhao-an
Electrical Engineering School Xi' an Jiaotong University Xi' an Power Electronic Research Institute Xi' an China |
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| Affiliation: | ZENG Xiang-jun,XU Yao-ling,WANG Xiao-bao,YANG Xu,WANG Zhao-an
1. Electrical Engineering School,Xi' an Jiaotong University,
2. Xi' an Power Electronic Research Institute, Xi' an 710049,China |
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| Abstract: | The research on the integrated power electronic module (IPEM) based on hybrid packaging technology at the medium power rate has been paid much attention to recently. When assembled with power chips very compact, the drive/ protection circuits will be seriously affected by the heat from power chips. This problem has been studied. A 3D Finite Element model of a wire-bonding IPEM is presented to analyze the thermal behavior and temperature rise inside the module . Specially, the temperature rise of the drive/protection circuits is evaluated and the experimental verification is given. When the module is encapsulated by silicon gel, but an air gap is sandwiched between power chips and drive/protection circuits, the thermal transfer problem of this module is studied experimentally. |
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| Keywords: | Integrated Power Electronic module heat transfer 3D Finite Element model |
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