功率LED柔性封装结构的设计与热特性分析

根据功率LED的柔性封装要求,提出了基于贴片式(SMD)封装的功率型LED柔性封装结构。对各层结构进行了优化设计,采用有限元分析(FEA),模拟了柔性封装结构LED的热场分布。对比研究了柔性LED与传统封装结构LED的热特性,并对弯曲状态下柔性衬底材料对芯片的应力进行了分析。结果表明,采用金属Cu箔衬底的柔性封装结构,其散热特性较好;Cu/超薄玻璃复合衬底替代Cu箔衬底,可以减少弯曲的应力,减少幅度达到2.5倍,散热特性基本相同。SMD柔性封装的LED不仅具有较好的热稳定性,且具有柔性可挠曲特性,其应用潜力很大。

Design and thermal characteristics analysis of power flexible LED packaging

In order to meet the need of power LED flexible packaging,the flexible structure of LED is proposed based on surface mounted device(SMD) packaging.Each layer of the flexible structure is optimized,and the heat distribution is simulated using the finite element analysis(FEA) method.Thermal characteristics of several flexible packaging structures are compared with those of the traditional LED structure.The stress developed in LED chips as a result of bending is analyzed.The results show that the flexible packaging structure with metal copper foil substrate has good thermal stability.Cu/ultra-thin glass composite substrate instead of Cu substrate makes only a little difference in heat disputation but effectively reduces the stress by up to 2.5 times.Power LED flexible packaging presents a great application potential because of its flexibility and thermal stability compared with the traditional LED packaging.