| 激光技术在刚挠性HDI板的应用——微导通孔形成，图形成形，外型加工 |
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| 引用本文： | 翁毅志.激光技术在刚挠性HDI板的应用——微导通孔形成，图形成形，外型加工[J].印制电路信息,2004(7):53-56. |
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| 作者姓名： | 翁毅志 |
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| 摘 要： | 概述了采用一个激光源能够加工刚性和挠性板的一种新型激光技术,PCB制造商可能采用最小的投资和提高生产率而进入HDI市场。
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| 关 键 词： | 激光钻孔 高密度互连 激光图形加工 激光铣切 |
PCB Laser Technology for Rigid and Flex HDI:Via Formation, Structuring, and Routing |
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| Dr.Dieter J. Meier Stephan H.Schmidt Translator: Weng Yizhi.PCB Laser Technology for Rigid and Flex HDI:Via Formation, Structuring, and Routing[J].Printed Circuit Information,2004(7):53-56. |
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| Authors: | DrDieter J Meier Stephan HSchmidt Translator: Weng Yizhi |
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| Affiliation: | Dr.Dieter J. Meier Stephan H.Schmidt Translator: Weng Yizhi |
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| Abstract: | A discussion of a new laser technology capable of working with both rigid and flexible boards using only one laser source. PCB manufacturers will be able to enter HDI market with a minimum investment and a guaranty of high yields for each technology step. |
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| Keywords: | laser drilling HDI laser structuring laser routing |
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