| 盲孔电镀问题分析与改善 |
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| 引用本文： | 吴云鹏.盲孔电镀问题分析与改善[J].印制电路信息,2011(4):89-92. |
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| 作者姓名： | 吴云鹏 |
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| 作者单位： | 天津普林电路股份有限公司研发中心,天津,300308 |
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| 摘 要： | 在HDI板制作过程中,盲孔电镀质量是决定电路板最终性能的关键步骤之一。文章主要针对几种常见的盲孔电镀问题,系统分析问题产生的原因,并提出相应的改善措施,避免缺陷的再次发生,提高盲孔电镀良率及性能的可靠性。
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| 关 键 词： | 盲孔电镀 异物 |
BMV plating problem analysis and improvement |
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| WU Yun-peng.BMV plating problem analysis and improvement[J].Printed Circuit Information,2011(4):89-92. |
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| Authors: | WU Yun-peng |
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| Affiliation: | WU Yun-peng |
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| Abstract: | In the process of HDI manufacture,the quality of blind micro vias(BMV) plating is a key step that can have a big influence to the PCB performance.The article is focus on some familiar problem of the BMV plating,and then the tests would be designed for finding the root cause.Further technical methods will be carried out to focus on the defective prevention to enhance the quality and reliability for BMV plating. |
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| Keywords: | BMV plating crab legs |
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