| 高阶表面结构刚挠结合印制板制作技术 |
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| 引用本文： | 宋建远,何淼,寻瑞平.高阶表面结构刚挠结合印制板制作技术[J].印制电路信息,2021(2). |
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| 作者姓名： | 宋建远 何淼 寻瑞平 |
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| 作者单位： | 崇达技术股份有限公司 |
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| 摘 要： | 高阶表面结构刚挠结合印制电路板集合了混压设计,不对称设计等特点,且挠性板在外层,导致开窗处高度差较大,这一特点给制作增添了较大难度。本文选取此类典型刚挠结合板产品,分享部分关键制作技术。
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| 关 键 词： | 高阶 表面结构 刚挠结合 印制电路板 |
High step surface structure Rigid-Flex PCB production technology |
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| Song Jianyuan,He Miao,Xun Ruiping.High step surface structure Rigid-Flex PCB production technology[J].Printed Circuit Information,2021(2). |
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| Authors: | Song Jianyuan He Miao Xun Ruiping |
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| Abstract: | High step surface structure rigid-flex PCB combines the characteristics of a mixed pressure design and an asymmetrical design.Especially the flexible plate is on the outer layer,resulting in a large difference in height at the window opening.This feature adds great difficulty to the production.This paper selects such typical rigid-flex board products and shares some key production techniques. |
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| Keywords: | High Step Surface Structure Rigid-Flex Printed Circuit Board |
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