HDI刚挠印制板中的埋盲孔工艺研究

电子产品日益向便携式发展，使得刚挠结合板的应用也扩大，如今已成为印制板工业中的研究热点。随着组装技术的提高，刚挠结合板出现了改善性设计，高密度互连成为其发展方向之一。文章结合实例，讨论了高密度互连刚挠结合板的制造工艺，并对刚挠结合板中埋盲孔工艺的关键技术做了研究。较详细地研究了埋盲孔工艺中的材料选择、层压、钻孔和孔金属化等问题，得到了较好的工艺参数，并通过飞针测试检测导电性能，孔的合格率达99．9％以上。

Research on the Process of Buried/blind Via in HDI Rigid-flex Board

The trend towards portability of electronic products expands the application of rigid-flex board,which has become one of the hot spots in PCB industry.Along with the improvement of assembly technology, the improving design of rigid-flex board appears.High Density Interconnection （HDI） is one of the design directions.The key technology of buried/blind via process for the manufacturing process of HDI rigid-flex board,and was studies in detail including material selections,laminate process,drilling process and hole metallization,and better process parameters were obtained.It was found that the rate of the conducting vias is over 99.9% by testing its electric performance.