| 3G手机对PCB行业的挑战 |
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| 引用本文： | 唐艳玲.3G手机对PCB行业的挑战[J].印制电路信息,2008(11):48-50. |
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| 作者姓名： | 唐艳玲 |
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| 作者单位： | 天津普林电路股份有限公司,天津,300250 |
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| 摘 要： | 3G手机时代的来临给PCB的制造技术带来了巨大的挑战，文章介绍了3G手机对PCB行业的影响、PCB高密度化的要求、CCL高性能化的要求、PCB加工技术的要求。
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| 关 键 词： | 3G手机 PCB行业 挑战 |
Challenge of 3G Mobile to PCB Industry |
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| TANG Yan-ling.Challenge of 3G Mobile to PCB Industry[J].Printed Circuit Information,2008(11):48-50. |
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| Authors: | TANG Yan-ling |
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| Affiliation: | TANG Yan-ling |
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| Abstract: | As the time of 3G mobile comes,the technology on PCB manufacture faces huge challenge,This article makes an introduction on 3G mobile's impact on PCB industry and its requirements on PCB with high density,on CCL with high performance,and on the processing technology of PCB. |
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| Keywords: | 3G mobile PCB industry challenge |
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