| 电解铜箔产业发展趋势 |
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| 引用本文： | 金荣涛.电解铜箔产业发展趋势[J].印制电路信息,2003,34(2):22-24,31. |
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| 作者姓名： | 金荣涛 |
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| 作者单位： | 铜陵中金铜箔公司,244000 |
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| 摘 要： | 随着技术的进步,电解铜箔在厚度上迅速向薄、超薄方向发展,THE、RCC、CAC等特殊性能铜箔需求比例快速 增加,以锂离子电池为代表的新应用领域正在形成。
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| 关 键 词： | 电解铜箔 RCC CAC 锂离子电池 |
| 修稿时间： | 2002年11月6日 |
Development Trend of Electrolytic Copper Foil |
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| Jin Rongtao.Development Trend of Electrolytic Copper Foil[J].Printed Circuit Information,2003,34(2):22-24,31. |
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| Authors: | Jin Rongtao |
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| Affiliation: | Jin Rongtao |
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| Abstract: | Abstrate With the development of technology, electrolytic copper foil is tending to be thinner.The demand for special copper foil like THE,RCC,CAC etc. is increasing rapidly,while a new area of appliance represented by li-ion battery is forming. |
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| Keywords: | electrolytic copper foil RCC CAC Li-ion battery |
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