|
|||||
|
|
| FPC用聚酰亚胺材料 | |
| 引用本文： | 蔡积庆.FPC用聚酰亚胺材料[J].印制电路信息,2004,9(4):24-28. |
| 作者姓名： | 蔡积庆 |
| 作者单位： | 南京无线电八厂 |
| 摘 要： | 概述了非热塑性聚酰亚胺膜,热塑性聚酰亚胺膜和感光性聚酰亚胺保护膜等聚酰亚胺系列产品,适用于制造高性能的FPC。 |
| 关 键 词： | 非热塑性聚酰亚胺膜 热塑性聚酰亚胺膜 感光性聚酰亚胺保护膜 积层板 |
Polyimide Material for FPC |
|
| Cai Jiqing.Polyimide Material for FPC[J].Printed Circuit Information,2004,9(4):24-28. | |
| Authors: | Cai Jiqing |
| Abstract: | This paper describes the non-thermoplastic polyimide film, thermoplastic polyimide film and photoactive polyimide cover lay film etc. Polyimide series products. They are suitable to manufaturing high performance flexible printed circuit (FPC). |
| Keywords: | non-thermoplastic polyimide film thermoplastic polyimide film photoactive polyimide coverlay film build-up board |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |