| 浅谈电子产品无铅化 |
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| 引用本文： | 王春霞,朱延枫.浅谈电子产品无铅化[J].印制电路信息,2010(5):46-48. |
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| 作者姓名： | 王春霞 朱延枫 |
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| 作者单位： | 辽宁工业大学电气工程学院,辽宁,锦州,121001 |
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| 摘 要： | 鉴于铅对人体及自然环境的危害性，文章从电子产品无铅化的提出、焊料的无铅化、电子器件的无铅化、无铅化实施过程中存在的问题这几个方面阐述电子产品的无铅化。
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| 关 键 词： | 无铅焊料：熔点 合金 |
Lead-free Solder in Electronic Products |
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| WANG Chun-xia,ZHU Yan-feng.Lead-free Solder in Electronic Products[J].Printed Circuit Information,2010(5):46-48. |
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| Authors: | WANG Chun-xia ZHU Yan-feng |
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| Affiliation: | WANG Chun-xia ZHU Yan-feng |
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| Abstract: | Regarding the harmfulness about lead on the human body and natural environment, the paper describes some aspects about lead-free solder, which include the lead-free electronic products, lead-free solder, lead-free electronics and the problems in the lead-free carrying out. |
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| Keywords: | lead-free solder melting point alloy |
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