| 浅析各工序异物塞孔原因 |
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| 引用本文： | 周定忠,庾文武,李伟保.浅析各工序异物塞孔原因[J].印制电路信息,2013(10):60-62. |
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| 作者姓名： | 周定忠 庾文武 李伟保 |
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| 作者单位： | 胜华电子（惠阳）有限公司,广东惠州516257 |
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| 摘 要： | 塞孔问题现已经成为PCB生产过程中不容忽视的质量问题，本文通过逐一分析各工序塞孔的特征，找出造成塞孔的原因，为生产工序提供参考，最终降低塞孔导致的报度。
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| 关 键 词： | 塞孔 特征 报废 |
The root cause of plug hole in each process |
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| ZHOU Ding-zhong,YU Wen-wu,LI Wei-bao.The root cause of plug hole in each process[J].Printed Circuit Information,2013(10):60-62. |
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| Authors: | ZHOU Ding-zhong YU Wen-wu LI Wei-bao |
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| Affiliation: | ZHOU Ding-zhong YU Wen-wu LI Wei-bao |
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| Abstract: | Plug hole has now become the phenomenon of PCB production which can not be ignored. Through the analysis of the characteristics of the plug hole in each process one by one, this paper is to find out the cause of plug hole, to provide reference for production process, and reduce plug hole which leads to scrap eventually. |
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| Keywords: | Plug Hole Characteristics Scrap |
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