| PCB电镀铜工艺和常见问题的处理 |
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| 引用本文： | 林其水.PCB电镀铜工艺和常见问题的处理[J].印制电路信息,2009(4):46-49,62. |
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| 作者姓名： | 林其水 |
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| 作者单位： | 福建,福州,350003
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| 摘 要： | 印制电路板（PCB）电镀主要包括电镀铜、电镀锡、电镀镍和电镀金等。其中电镀铜是PCB制作中的一个重要工艺，文章主要介绍电镀铜的工艺技术、应注意的操作技术问题和一些常见问题的处理方法。
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| 关 键 词： | 印制电路板 电镀铜 |
Copper Plating Process for Printed Circuit Board and Disposal of Common Problems |
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| LIN Qi-shui.Copper Plating Process for Printed Circuit Board and Disposal of Common Problems[J].Printed Circuit Information,2009(4):46-49,62. |
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| Authors: | LIN Qi-shui |
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| Affiliation: | LIN Qi-shui |
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| Abstract: | The printed circuit board （PCB） copper plating include to copper electroplating, stannum electroplating,nickel electroplating and aurum electroplating etc..Among them electroplating copper is an important craft within the circuit board manufacture,this text is main to introduce the craft technique of electroplate the copper, the processing method of the operation technique problem and some familiar problems that should notice. |
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| Keywords: | PCB copper electroplating |
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