| 印制电路组件用高导热有机硅灌封料的研究 |
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| 引用本文： | 张敏,胡文成,何为.印制电路组件用高导热有机硅灌封料的研究[J].印制电路信息,2011(5):58-60. |
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| 作者姓名： | 张敏 胡文成 何为 |
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| 作者单位： | 电子科技大学微电子与固体电子学院,四川,成都,610054 |
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| 摘 要： | 将自蔓延方法制备的氮化铝粉体加入到有机硅树脂中,制备出导热性能优良的印制电路组件用高导热有机硅灌封材料,并详细介绍了该灌封料的灌封工艺过程。
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| 关 键 词： | 氮化铝粉体 有机硅树脂 灌封料 工艺 |
Investigation of high thermal conductivity silicone polymers encapsulant for printed circuit board assembly |
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| ZHANG Min,HU Wen-chen,HE Wei.Investigation of high thermal conductivity silicone polymers encapsulant for printed circuit board assembly[J].Printed Circuit Information,2011(5):58-60. |
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| Authors: | ZHANG Min HU Wen-chen HE Wei |
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| Affiliation: | ZHANG Min HU Wen-chen HE Wei |
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| Abstract: | High thermal conductivity silicone polymers encapsulant used for printed circuit board assembly has been investigated.The AlN powders prepared by self-propagating high-temperature synthesis are mixed into silicone polymer,which leads the encapsulant possessing a high thermal conductivity.In addition,the encapsulating technology of this encapsulant is described in details. |
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| Keywords: | AlN powders silicone polymers encapsulant encapsulating technology |
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