3D-MIDS改性塑料的激光活化和金属化

在电路板加工工业中,三维模型互连技术3D-MID(three dimensional mould interconnect device)的市场正在飞速发展并且有巨大的潜力。电子元件小型化、柔性设计、定量生产和生产流程简化是3D-MID发展的主要推动力。 本文介绍了一种叫做激光直接线路成形LDS(laser direct structuring) 艺的3D-MID技术。这种工艺的原理是首先用激光有选择地对改性塑料制品的表面进行活化,然后通过化学镀方法使铜、镍、金等金属沉积在活化区域以完成电路布线。采用这种工艺,不仅可以实现高灵活性生产,而且使超微细电路制造和微细装配成为可能。

Laser Activation and Metallization of Modified Thermopiastics for 3d-mids

The market for 3D-MID (three-dimensional mould-tnterconnecr-devices) within the circuit board industry grows rapidly and has high future potentials. Miniaturization of electrical components, design flexibility, a more rational production and the reduction of production steps are the main driving forces behind the development. The article describes a new technology of 3D-MID that's named LDS (laser direct structuring). The process is at first the surface of a modified then moplastic is partially activated by a laser beam, in a following electroless plating process copper, nickel and gold are deposited on the activated ares completing the circuit tracks. Besides highly flexbility, ultra fine line circuits and very small assemblies are passible by this production technology.