| 高速信号过孔对信号影响因素研究 |
| |
| 引用本文： | 余凯,胡新星,刘丰,华炎生.高速信号过孔对信号影响因素研究[J].印制电路信息,2014(6):20-22,31. |
| |
| 作者姓名： | 余凯 胡新星 刘丰 华炎生 |
| |
| 作者单位： | 珠海方正印刷电路板发展有限公司,广东珠海519100 |
| |
| 摘 要： | 影响信号完整性的因素有很多，其中过孔结构对信号影响越来越明显，如何进行有效的过孔设计从而使过孔阻抗与激励源阻抗配从而达到信号完整性已经成为当今PCB设计业界中的一个热门课题。文章通过Ansys公司的HFSS仿真软件，利用仿真方法分析不同信号过孔结构对高速信号的影响，并对过孔残桩长度（stub），反焊盘，焊盘的不同大小对信号差损影响程度做了进一步研究。
|
| 关 键 词： | 高速印制电路板 信号完整性 焊盘 反焊盘 短桩 正交实验设计（DOE） |
Analysis of effects factors of high speed signal via on signal |
| |
| YU Kai,HU Xin-xing,LIU Feng,HUA Yan-sheng.Analysis of effects factors of high speed signal via on signal[J].Printed Circuit Information,2014(6):20-22,31. |
| |
| Authors: | YU Kai HU Xin-xing LIU Feng HUA Yan-sheng |
| |
| Affiliation: | YU Kai, HU Xin-xing, LIU Feng, HUA Yan-sheng |
| |
| Abstract: | Many factors can affect SI, and the via structure’s impact is more and more obvious. How to control the via impedance to match the excitation source’s impedance, thus, reduce SI problem. This is a new hot topic in PCB design. In this paper, the inlfuence of different via structure on high-speed signal is analyzed with simulation by ANSYS’s HFSS. Meanwhile we make further study on the inlfuence of remaining stub lengths, the size of anti-pad and pad on signal insertion loss proifle. |
| |
| Keywords: | High-speed PCB Signal Integrity Pad Antipad Stub DOE |
| 本文献已被 CNKI 维普 等数据库收录！ |
