| 化学镍金生产中的问题探讨简 |
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| 引用本文： | 张彦峰,代凤双,张刚强.化学镍金生产中的问题探讨简[J].印制电路信息,2014(1):68-70. |
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| 作者姓名： | 张彦峰 代凤双 张刚强 |
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| 作者单位： | 洛阳伟信电子科技有限公司,河南洛阳471000 |
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| 摘 要： | 文章主要探讨了化学镍金生产中所遇到的问题，如渗镀、漏镀、金面粗糙问题，结合我公司实际情况，进行的解决和改善的过程，为化学镍金生产积累了宝贵的经验，提高了我公司化学镍金的生产水平。
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| 关 键 词： | 化学镍金 渗镀 漏镀 金层粗糙 |
Study of problems in the production of electroless nickel/immersion gold process |
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| ZHANG Yan-feng,DAi Feng-shuang ZHANG Gang-qiang.Study of problems in the production of electroless nickel/immersion gold process[J].Printed Circuit Information,2014(1):68-70. |
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| Authors: | ZHANG Yan-feng DAi Feng-shuang ZHANG Gang-qiang |
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| Affiliation: | ZHANG Yan-feng DAi Feng-shuang ZHANG Gang-qiang |
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| Abstract: | This paper mainly discusses the problems encountered in the production of Electroless Nickel/ Immersion Gold process, such as diffusion coating, leak-plated, gold surface roughness, combined with our actual situation, solutions and improvements in the process for electroless nickel gold production as well as accumulated valuable experience to improve our company ENIG production levels. |
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| Keywords: | ENIG Diffusion Coating Leak-Plated Gold Surface Roughness |
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