| 不同电流密度对直流电镀填盲孔的影响研究 |
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| 引用本文： | 张剑如.不同电流密度对直流电镀填盲孔的影响研究[J].印制电路信息,2014(4):38-41. |
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| 作者姓名： | 张剑如 |
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| 作者单位： | 汕头超声印制板公司,广东汕头515041 |
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| 摘 要： | 电镀填盲孔是HDI加工的一个重要工序。本文通过研究不同电流密度在不同电镀时间内的填孔行为，并尝试通过采用组合电流密度来提升电镀填盲孔效果，从而实现降低填孔镀铜量的目的。
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| 关 键 词： | 电流密度 填孔行为 |
Study on the inlfuence of micro via iflling with different current density |
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| ZHANG Jian-ru.Study on the inlfuence of micro via iflling with different current density[J].Printed Circuit Information,2014(4):38-41. |
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| Authors: | ZHANG Jian-ru |
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| Affiliation: | ZHANG Jian-ru |
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| Abstract: | Micro via iflling is an essential step of the HDI process.This article studies the iflling behavior with different current densities at different plating time,and tries to improve micro via iflling effect with the use of a combination current density, that can reduce the surface thickness. |
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| Keywords: | Current Density Filling Behavior |
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