|
|||||
|
|
| FPC用电解铜箔——HL铜箔 | |
| 引用本文： | 蔡积庆.FPC用电解铜箔——HL铜箔[J].印制电路信息,2005,7(6):21-23,52. |
| 作者姓名： | 蔡积庆 |
| 摘 要： | 概述了离延伸率和纸纵断面铜箔——HL铜箔的开发。HL铜箔的机械特性并不逊色于压延铜箔,适用于制造高密度的细线化FPC。 |
| 关 键 词： | 电解铜箔-HL铜箔 压延铜箔 机械性能 表面处理 挠性板(FPC) |
Elctrolytic Copper Foil-HL Copper Foil for FPC |
|
| Cai Jiqing.Elctrolytic Copper Foil-HL Copper Foil for FPC[J].Printed Circuit Information,2005,7(6):21-23,52. | |
| Authors: | Cai Jiqing |
| Abstract: | This paper describes the development of high elongation and low profile copper foil-HL copperfoil.Mechanical characteristic of HL copper foil is equal to draw copper foil or over, HL copper foil is suitable tomanufactur high density and fine line FPC. |
| Keywords: | electrolytic copper foil draw copper foil mechamical characteristic surface treatmentflexible printed circuit (FPC) |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |