| 塑料生物芯片的激光焊接封装系统研究 |
| |
| 引用本文： | 陈西曲,赖建军,刘胜,易新建.塑料生物芯片的激光焊接封装系统研究[J].微纳电子技术,2003(Z1). |
| |
| 作者姓名： | 陈西曲 赖建军 刘胜 易新建 |
| |
| 作者单位： | 华中科技大学微系统中心 湖北武汉430074
(陈西曲，赖建军，刘胜)，华中科技大学微系统中心 湖北武汉430074(易新建) |
| |
| 摘 要： | 介绍了采用半导体激光器在塑料生物芯片焊接封装系统的应用 ,论述了塑料生物芯片焊接封装原理和工艺 ,提出了基于 80 8nm半导体激光器的塑料焊接封装系统的设计方法 ,分析了焊接封装的参数选择 ,实现了部分塑料之间的成功焊接
|
| 关 键 词： | 塑料生物芯片 激光 焊接封装系统 |
Research on laser assisted bonding and packaging system for plastic biochips |
| |
| CHEN Xi qu,LAI Jian jun,LIU Sheng,YI Xin jian.Research on laser assisted bonding and packaging system for plastic biochips[J].Micronanoelectronic Technology,2003(Z1). |
| |
| Authors: | CHEN Xi qu LAI Jian jun LIU Sheng YI Xin jian |
| |
| Abstract: | The appliance of semiconductor laser assisted bonding and packaging for plastic biochips is introduced, and the principle of laser locally heating and bonding for plastic biochips is deduced. A diode laser bonding setup is experimentally established. Parameters of bonding and packing are analyzed, and some plastics materials bonding are successfully realized . |
| |
| Keywords: | plastic biochips laser bonding and packaging system |
| 本文献已被 CNKI 等数据库收录！ |
