| 应用于微系统封装的激光局部加热键合技术 |
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| 引用本文： | 赖建军,陈西曲,周宏,刘胜,易新建.应用于微系统封装的激光局部加热键合技术[J].微纳电子技术,2003(Z1). |
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| 作者姓名： | 赖建军 陈西曲 周宏 刘胜 易新建 |
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| 作者单位： | 华中科技大学微系统中心 湖北武汉430074
(赖建军，陈西曲，周宏，刘胜)，华中科技大学微系统中心 湖北武汉430074(易新建) |
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| 摘 要： | 阐述了利用激光与物质相互作用的热效应实现微系统器件的局部加热键合原理 ,提出了激光键合塑料芯片和激光辅助加热阳极键合的思想 ,建立了半导体激光键合实验装置 ,并实现了聚甲基丙烯酸甲酯 (PMMA)之间的键合
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| 关 键 词： | 激光 局部加热 键合 微系统 |
Laser locally heating and bonding for microsystem packaging |
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| LAI Jian jun,CHEN Xi qu,ZHOU Hong,LIU Sheng,YI Xin jian.Laser locally heating and bonding for microsystem packaging[J].Micronanoelectronic Technology,2003(Z1). |
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| Authors: | LAI Jian jun CHEN Xi qu ZHOU Hong LIU Sheng YI Xin jian |
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| Abstract: | Principle of Laser locally heating and bonding for microsystem packaging is introduced and techniques of laser boding plastics chips, laser assisted heating and anodic bonding are conceptually investigated. A diode laser bonding setup is experimentally established and successfully used to bond plastics materials such as PMMA sheets. |
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| Keywords: | laser locally heating bonding microsystem |
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