| 微电子封装用导电胶的研究进展 |
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| 引用本文： | 雷芝红,贺英,高利聪.微电子封装用导电胶的研究进展[J].微纳电子技术,2007,44(1):46-50. |
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| 作者姓名： | 雷芝红 贺英 高利聪 |
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| 作者单位： | 上海大学,材料科学与工程学院高分子材料系,上海,201800 |
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| 摘 要： | 介绍了导电胶的组成、分类及与传统锡-铅焊料相比导电胶的优点。阐述了导电胶的导电机理、失效机理以及国内外的研究现状。
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| 关 键 词： | 导电胶 导电机理 接触电阻 |
| 文章编号： | 1671-4776(2007)01-0046-05 |
| 修稿时间： | 2006-07-23 |
Progress in Conductive Adhesives for Microelectronic Packages |
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| LEI Zhi-hong,HE Ying,GAO Li-cong.Progress in Conductive Adhesives for Microelectronic Packages[J].Micronanoelectronic Technology,2007,44(1):46-50. |
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| Authors: | LEI Zhi-hong HE Ying GAO Li-cong |
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| Affiliation: | Department of Polymer Materials, School of Materials Science and Engineering, Shanghai University, Shanghai 201800, China |
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| Abstract: | The composition, classes, advantages and disadvantages of conductive adhesives compared with traditional Sn/Pb solder were introduced. Recent advances in the research on conductive adhesives were discussed, with the emphasis on the conduction and failure mechanism. |
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| Keywords: | conductive adhesives conduction mechanism contact resistance |
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