| 一种声表面波器件的新型晶圆级封装技术 |
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| 引用本文： | 冷俊林,杨静,毛海燕,杨正兵,汤旭东,余欢,杨增涛,董姝,伍平.一种声表面波器件的新型晶圆级封装技术[J].压电与声光,2011,33(4). |
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| 作者姓名： | 冷俊林 杨静 毛海燕 杨正兵 汤旭东 余欢 杨增涛 董姝 伍平 |
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| 作者单位： | 中国电子科技集团公司第26研究所,重庆,400060 |
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| 摘 要： | 总结了声表面波(SAW)器件传统封装技术中存在的问题,提出了一种SAW器件新型晶圆级封装技术。采用一种有机物干膜,分别经两次压膜、曝光和显影完成了对SAW芯片在划片前的封装,并用实验进行了验证。实验结果表明,本技术具有在不改变叉指换能器(IDT)质量负载的情况下同时具备吸声的功能,改善器件的带外抑制能力,增强了产品的一致性和可靠性。本技术在SAW器件的封装方面有广阔的应用前景。
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| 关 键 词： | 声表面波(SAW) 晶圆级封装技术 干膜 |
A Novel Wafer Level Package Technology for SAW Devices |
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| LENG Junlin,YANG Jing,MAO Haiyan,YANG Zhengbing,TANG Xudong,YU Huan,YANG Zengtao,DONG Shu,WU Ping.A Novel Wafer Level Package Technology for SAW Devices[J].Piezoelectrics & Acoustooptics,2011,33(4). |
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| Authors: | LENG Junlin YANG Jing MAO Haiyan YANG Zhengbing TANG Xudong YU Huan YANG Zengtao DONG Shu WU Ping |
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| Affiliation: | LENG Junlin,YANG Jing,MAO Haiyan,YANG Zhengbing,TANG Xudong,YU Huan,YANG Zengtao,DONG Shu,WU Ping(26th Institute of China Electronics Technology Group Corporation,Chongqing 400060,China) |
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| Abstract: | Many drawbacks in the traditional package technology of SAW devices were summarized in this paper.To overcome these drawbacks,a novel wafer level package technology for SAW devices using a kind of dry organic film was presented.Through this technology,laminating process,exposing process and developing process were operated twice respectively before the wafer slice.The experimental results showed that the wet organic film which absorbed acoustic waves could act as sound absorption material without adding mas... |
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| Keywords: | SAW wafer level package technology dry film |
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