| 楔焊焊点间的高度差对引线强度的影响 |
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| 引用本文： | 袁羽辉.楔焊焊点间的高度差对引线强度的影响[J].红外,2022,43(2):40-43. |
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| 作者姓名： | 袁羽辉 |
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| 作者单位： | 华北光电技术研究所,北京100015 |
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| 摘 要： | 作为红外探测器封装中的关键工艺,引线键合的质量直接影响红外探测器组件的性能及使用寿命.通过在陶瓷基板与读出电路之间粘接不同厚度的陶瓷垫片来调整焊点间的高度.在键合后使用DAGE-SERIES-4000-PXY拉力测试仪得到不同高度差下的引线拉力.实验结果表明,当陶瓷基板与读出电路间未粘接陶瓷垫片时,引线强度最高.随着陶...
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| 关 键 词： | 楔形键合 影响因素分析 红外探测器 |
| 收稿时间： | 2021/9/14 0:00:00 |
| 修稿时间： | 2021/10/30 0:00:00 |
Influence of Height Difference Between Wedge Solder Joints on the Strength of Lead Wire |
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| YUAN Yu-hui.Influence of Height Difference Between Wedge Solder Joints on the Strength of Lead Wire[J].Infrared,2022,43(2):40-43. |
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| Authors: | YUAN Yu-hui |
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| Affiliation: | North China Research Institute of Electro-Optics |
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| Abstract: | As a key technology in infrared detector packaging, the quality of lead bonding directly affects the performance and service life of infrared detector components.The height between solder joints is adjusted by bonding ceramic gaskets of different thicknesses between the ceramic substrate and the readout circuit. After bonding, DAGE-SERIES-4000-PXY tension tester is used to obtain the lead tension under different height differences.Experimental results show that the lead strength is the highest when there is no ceramic gasket bonded between the ceramic substrate and the readout circuit. As the thickness of ceramic gasket increases, the lead strength decreases. |
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| Keywords: | wedge bonding analysis of influencing factors infrared detector |
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