| 楔焊和金丝球键合参数对键合拉力的影响 |
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| 引用本文： | 袁羽辉,刘杰,付志凯.楔焊和金丝球键合参数对键合拉力的影响[J].红外,2021,42(6):24-28. |
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| 作者姓名： | 袁羽辉 刘杰 付志凯 |
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| 作者单位： | 华北光电技术研究所,空装驻北京地区第七军事代表室,华北光电技术研究所 |
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| 摘 要： | 以实际工艺的使用为出发点，主要研究了压力、功率以及时间对超声楔焊和热超声球焊中第一焊点焊接质量的影响。根据拉力测试仪得到的拉力值来判断焊接质量的好坏。给出了满足探测器芯片楔焊和球焊质量要求的工艺参数，并达到了提高整体焊接质量的目的。另外还研究了热超声球焊焊接后的两种补强方式，并对比了它们对引线键合的影响。
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| 关 键 词： | 引线键合 工艺参数 影响因素分析 |
| 收稿时间： | 2020/11/26 0:00:00 |
| 修稿时间： | 2020/12/28 0:00:00 |
Influences of Bonding Parameters of Wedge Welding and Gold Ball on Bonding Tension |
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| YUAN Yu-hui,LIU Jie and FU Zhi-kai.Influences of Bonding Parameters of Wedge Welding and Gold Ball on Bonding Tension[J].Infrared,2021,42(6):24-28. |
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| Authors: | YUAN Yu-hui LIU Jie and FU Zhi-kai |
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| Affiliation: | North China Research Institute of Electro-Optics,The 7th Military Representative Office, Air Force Equipment Department in Beijing,North China Research Insitute of Electro-Optics |
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| Abstract: | The influences of pressure, power and time on the welding quality of the first joint of ultrasonic wedge welding and thermosonic bonding are studied based on practical application. The welding quality is determined according to the tension values measured by the tension tester, and the technological parameters satisfying the quality requirements of wedge and ball welding of detector chips are given. The overall welding quality is improved as well. In addition, two reinforcing methods after thermosonic bonding are studied, and the effects of the two methods are compared. |
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| Keywords: | wire bonding technological parameter analysis of influence factors |
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