| 基于倒装焊芯片的功率型LED热特性分析 |
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| 引用本文： | 罗元,魏体伟,王兴龙.基于倒装焊芯片的功率型LED热特性分析[J].半导体光电,2012,33(3):321-324,328. |
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| 作者姓名： | 罗元 魏体伟 王兴龙 |
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| 作者单位： | 重庆邮电大学光纤通信技术重点实验室,重庆,400065;重庆平伟实业集团股份有限公司,重庆,405200 |
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| 摘 要： | 对LED的导散热理论进行了研究,推导出了倒装焊LED芯片结温与封装材料热传导系数之间的关系。通过分析倒装焊LED的焊球材料、衬底粘结材料和芯片内部热沉材料对芯片结温的影响,表明衬底粘结材料对LED的结温影响最大,并且封装材料热传导系数的变化率与封装结构的传热厚度成反比,与传热面积成正比。该研究为倒装焊LED封装结构和材料的设计提供了理论支持。
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| 关 键 词： | LED 封装材料 倒装焊 热阻 |
Analysis on Thermal Characteristics of High Power LED based on Flip-chip |
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| LUO Yuan,WEI Tiwei,WANG Xinglong.Analysis on Thermal Characteristics of High Power LED based on Flip-chip[J].Semiconductor Optoelectronics,2012,33(3):321-324,328. |
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| Authors: | LUO Yuan WEI Tiwei WANG Xinglong |
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| Affiliation: | 1.College of Photoelectric Engineering,Chongqing University of Posts and Telecommunications,Chongqing 400065,CHN; 2.Chongqing Pingwei Enterprise Co.Ltd,Chongqing 405200,CHN) |
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| Abstract: | The variations of the junction temperature with the thermal conductivity coefficient of packaging materials are derived by Heat conduction equation and Thermal resistance formula.On this basis,the impacts on the chip junction temperature of the ball materials,substrate bonding materials and heat sink materials of Flip-chip LED are analyzed with the tool of ANSYS finite element,and the conclusions are verified.It is shown that the thickness of the package structure,heat transfer area and thermal conductivity of packaging materials play an important role in LED chip temperature,and the substrate bonding material has the maximum effect on the junction temperature of LED. |
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| Keywords: | LED packaging materials flip-chip thermal resistance |
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