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大功率白光LED封装设计与研究进展
引用本文:陈明祥,罗小兵,马泽涛,刘胜. 大功率白光LED封装设计与研究进展[J]. 半导体光电, 2006, 27(6): 653-658
作者姓名:陈明祥  罗小兵  马泽涛  刘胜
作者单位:华中科技大学;华中科技大学
基金项目:湖北省科技攻关计划招标项目
摘    要:封装设计、材料和结构的不断创新使发光二极管(LED)性能不断提高.从光学、热学、电学、机械、可靠性等方面,详细评述了大功率白光LED封装的设计和研究进展,并对封装材料和工艺进行了具体介绍.提出LED的封装设计应与芯片设计同时进行,并且需要对光、热、电、结构等性能统一考虑.在封装过程中,虽然材料(散热基板、荧光粉、灌封胶)选择很重要,但封装工艺(界面热阻、封装应力)对LED光效和可靠性影响也很大.

关 键 词:固态照明  大功率LED  白光LED  封装
文章编号:1001-5868(2006)06-0653-06
收稿时间:2006-08-26
修稿时间:2006-08-26

Advances in Packaging Design and Research on High-power White LED
CHEN Ming-xiang,LUO Xiao-bing,MA Ze-tao,LIU Sheng. Advances in Packaging Design and Research on High-power White LED[J]. Semiconductor Optoelectronics, 2006, 27(6): 653-658
Authors:CHEN Ming-xiang  LUO Xiao-bing  MA Ze-tao  LIU Sheng
Affiliation:1. Institute of Microsystems, Huazhong University of Science and Technology, Wuhan 430074, CHN; 2. Division of MOEMS, Wuhan National Lab. for Optoelectronics, Wuhan 430074, CHN
Abstract:Innovative designs,materials and structures of packaging have led to dramatic improvements of the performances in LED technology.The rapid progresses in packaging design and research of high-power white light emitting diodes(LEDs) have been overviewed.The packaging design of LED has been summarized in the view of optics,thermology,electrics,mechanics and reliability,and the packaging material and processes have been introduced in detail.It is proposed that packaging and chip of LED should be co-designed,and the effect of optical,thermal,electrical and mechanical should be considered at the same time.Although it is important to choose packaging materials(such as thermal spreading substrate,phosphors and silicone),the interface thermal resistance and thermal stress resulting from packaging processes have greater effect on the luminous efficiency and reliability of packaged LED.
Keywords:solid state lighting   high-power LED   white LED  packaging
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