| 铜锡合金纳米粒子的制备和性能研究 |
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| 引用本文： | 韩孟序,潘志龙.铜锡合金纳米粒子的制备和性能研究[J].电子科技,2015,28(5):108. |
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| 作者姓名： | 韩孟序 潘志龙 |
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| 作者单位： | (西安电子科技大学 先进材料与纳米科技学院,陕西 西安 710071) |
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| 摘 要： | 通过化学还原方法制备了铜锡合金纳米粒子,并研究分析了其的尺寸和热学性能。铜锡纳米粒子的X射线衍射分析结果显示,合成产物主要是锡纳米颗粒和铜锡合金(Cu6Sn5)纳米颗粒组成,且这些纳米粒子并未被氧化。其示差扫描量热法测得结果表明,本次合成的纳米颗粒的熔点为202.98 ℃,适合现代电子封装技术对低熔点封装材料的要求。
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| 关 键 词： | 铜锡合金纳米粒子 封装材料 低熔点 |
Synthesis and Characterization of Cu-Sn Nanoparticles |
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| HAN Mengxu,PAN Zhilong.Synthesis and Characterization of Cu-Sn Nanoparticles[J].Electronic Science and Technology,2015,28(5):108. |
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| Authors: | HAN Mengxu PAN Zhilong |
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| Affiliation: | (School of Advanced Materials and Nanotechnology,Xidian University,Xi'an 710071,China) |
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| Abstract: | Cu Sn nanoparticles are prepared by chemical reduction method,whose sizes and thermal properties are studied.The X ray diffraction analysis results of the product show that the product is constituted primarily by Sn nanoparticles and Cu Sn nanoparticles (Cu6Sn5),and that the nanoparticles are not oxidized.The differential scanning calorimetry results of Cu Sn nanoparticles show that the melting point of nanoparticles is 202.98 ℃,very suitable for the low melting point electronic packaging material required by the modern packaging technology. |
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| Keywords: | Cu Sn nanoaprticles packaging material low melting point |
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