| 新型应力不敏感FBG温度传感封装结构 |
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| 引用本文： | 沙剑波,高侃. 新型应力不敏感FBG温度传感封装结构[J]. 光纤与电缆及其应用技术, 2009, 0(1): 8-10 |
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| 作者姓名： | 沙剑波 高侃 |
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| 作者单位： | 中国电子科技集团公司第二十三研究所,上海,200437 |
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| 摘 要： | 光纤Bragg光栅（FBG）可以同时传感多个参量，但当仅需测量一个参量时，测量结果可能会受到一个或多个其他参量的影响，其中以温度和应力交叉敏感最为突出。为此，对比了其他几种应力不敏感型FBG温度传感器的优缺点，设计了一种新型的应力不敏感FBG温度传感封装结构，并通过实验验证了其温度传感性能及应力不敏感性。
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| 关 键 词： | 光纤光栅 温度传感 应力不敏感 封装 |
A New Packaging Structure of Stress-Insensitive FBG Temperature Sensor |
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| SHA Jian-bo,GAO Kan. A New Packaging Structure of Stress-Insensitive FBG Temperature Sensor[J]. Optical Fiber & Electric Cable and Their Applications, 2009, 0(1): 8-10 |
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| Authors: | SHA Jian-bo GAO Kan |
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| Affiliation: | The 23rd Research Institute;CETC;Shanghai 200437;China |
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| Abstract: | Fiber Bragg grating(FBG) can be used for measuring many parameters simultaneously.However when used for measuring a single parameter,the measurements may be affected by one or more other parameters.It has been proved particularly difficult to eliminate the temperature-stress cross sensitivity.Consequently,the advantages and disadvantages of some other stress-insensitive FBG temperature sensors are compared,and a new packaging structure of stress-insensitive FBG temperature sensor is proposed. Its temperatur... |
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| Keywords: | fiber optic grating temperature sensing stress insensitive packaging |
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