A hybrid tile approach for Ka band subarray modules

A “thin” array construction using tile module architecture is presented in this paper. Several transmit-only tile modules operating at 30 GHz have been fabricated. The tile module involves a layered construction that contributes to reduced array thickness, weight, and cost. In such layered construction, the radiating aperture, active devices, and signal distribution functions are placed in different layers and involve vertical interconnections. The subarray module described involves a hybrid construction in which conventional wire bonding is utilized for interconnecting devices to the signal distribution layers. As in conventional modules, the devices are mounted on the carrier plates and fully tested before insertion in the module. The radiating elements which are integral to the module housing are connected to the devices through electromagnetic coupling. This hybrid construction is a first step towards a fully batch-processed tile module architecture. The construction approach and the performance results at the module and array level are presented