Interfacial reaction between Sn-Bi alloy and Ni substrate |
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Authors: | J Wang H S Liu L B Liu Z P Jin |
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Affiliation: | (1) School of Materials Science and Engineering, Central South University, 410083 ChangSha, Hunan, P. R. China |
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Abstract: | Interfacial reactions between Sn-Bi alloys of different compositions and Ni substrates at 423 K for different durations were
investigated. Only one interfacial phase, Ni3Sn4, was detected despite the existence of several other intermetallic compounds (IMCs) in Ni-Sn and Ni-Bi binary systems. This
observation (only Ni3Sn4 was formed at the interface) was explained as a combination of the driving force for formation of the IMC and diffusion of
Ni. The change of Ni3Sn4 layer thickness as a function of annealing time, which obeys a parabolic rule, was further confirmed. The thickness of Ni3Sn4 was also found to decrease with increasing Bi content in the Sn-Bi alloy. |
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Keywords: | Interfacial reaction driving force Sn-Bi alloy Ni substrate |
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