Influence of interfacial reaction layer on reliability of chip-scale package joint from using Sn-37Pb and Sn-8Zn-3Bi solder |
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| Authors: | Chung-Hee Yu Kyung-Seob Kim Hyung-Il Kim Hyo-Joeng Jeon |
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| Affiliation: | (1) Optical Reliability Qualification Team, ETRI, 305-350 Daejeon, Korea;(2) Department of Electronic Engineering, Yeojoo Institute of Technology, 469-705 Yeojoo, Korea;(3) Department of Mechanical Engineering, UCLA, 90005 Los Angeles, CA;(4) School of Mechanical Engineering, Chung-Ang University, 156-756 Seoul, Korea |
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| Abstract: | The microstructure of Sn-37Pb and Sn-8Zn-3Bi solders and the full strength of these solders with an Au/Ni/Cu pad under isothermal
aging conditions were investigated. The full strengths tended to decrease as the aging temperature and time increased, regardless
of the properties of the solders. The Sn-8Zn-3Bi had higher full strength than Sn-37Pb. In the Sn-37Pb solder, Ni3Sn4 compounds and irregular-shaped Pb-rich phase were embedded in a β-Sn matrix. The Ni3Sn4 compounds were observed at the interface between the solder and pad. The microstructure of the as-reflowed Sn-8Zn-3Bi solder
mainly consists of the β-Sn matrix scattered with Zn-rich phase. Zinc first reacted with Au and then was transformed to the
AuZn compound. With aging, Ni5Zn21 compounds were formed at the Ni layer. Finally, a Ni5Zn21 phase, divided into three layers, was formed with column-shaped grains, and the thicknesses of the layers were changed. |
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| Keywords: | Lead-free Sn-8Zn-3Bi aging treatment intermetallic compound (IMC) |
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