Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization |
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Authors: | Hongjin Jiang Kyoung-Sik Moon Jiongxin Lu C P Wong |
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Affiliation: | (1) School of Materials Science and Engineering, USA;(2) School of Chemistry and Biochemistry, Georgia Institute of Technology, 30332-0245 Atlanta, GA |
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Abstract: | Five different types of surfactants were employed for nanoparticle functionalization and the effects of the surfactants on
electrical properties of nano silver (Ag)-filled conductive adhesives were investigated. The Ag nanoparticles pretreated with
the surfactants were incorporated into isotropic conductive adhesives (ICA) formulations as conductive fillers. By using the
surfactants (S3, S4, and S5), the reduced resistivity of the nano Ag-filled adhesives could be achieved with 2×10−4 Θ-cm. The morphology studies showed that the low resistivity resulted from the sintering of nanoparticles. |
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Keywords: | Surfactants nanoparticles conductive adhesives |
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