| 塑料封装铜丝内连电子元器件开封新工艺研究 |
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| 引用本文： | 杭春进,王春青,田艳红,张丞.塑料封装铜丝内连电子元器件开封新工艺研究[J].电子工艺技术,2008,29(1):5-7,11. |
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| 作者姓名： | 杭春进 王春青 田艳红 张丞 |
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| 作者单位： | 1. 哈尔滨工业大学,黑龙江,哈尔滨,150001
2. 南通富士通微电子股份有限公司,江苏,南通,226006 |
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| 摘 要： | 采用两种开封工艺对塑料封装、铜丝内连的电子元器件进行了开封实验.通过自动开封机对开封工艺参数的精确控制,使用浓硝酸与浓硫酸的混合液对样件进行开封,比较完整的保留了铜丝内连结构,达到了开封测试的基本要求.另外通过在混合腐蚀液中添加过量CuSO4·5H2O晶体使腐蚀液中的Cu2 在开封过程中始终保持饱和溶解状态下进行手工开封,结果表明改进后的腐蚀液对铜丝及铜球焊点的腐蚀破坏得到有效抑制.研究结果对于解决塑料封装、铜丝内连电子器件开封测试的难题具有指导意义.
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| 关 键 词： | 塑料封装 铜丝内连 电子元器件 开封 |
| 文章编号： | 1001-3474（2008）01-0005-04 |
| 收稿时间： | 2007-11-20 |
| 修稿时间： | 2007年11月20 |
Novel Decapsulation Process for Plastic Packaging Electronic Device With Copper Wire Interconnection |
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| HANG Chun-jin,WANG Chun-qing,TIAN Yan-hong,ZHANG Cheng.Novel Decapsulation Process for Plastic Packaging Electronic Device With Copper Wire Interconnection[J].Electronics Process Technology,2008,29(1):5-7,11. |
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| Authors: | HANG Chun-jin WANG Chun-qing TIAN Yan-hong ZHANG Cheng |
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| Affiliation: | HANG Chun-jin1,WANG Chun-qing1,TIAN Yan-hong1,ZHANG Cheng2(1.Harbin Institute of Technology,Harbin 150001,China2.Nantong Fujistu Microelectronics co.,LTD,Nantong 226006,China) |
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| Abstract: | Two decapsulation processes were used to decapsulate the plastic packaging electronic device with copper wire interconnection.Under the well control of decapsulation process parameters by an automatic decapsulator,the copper wire interconnections in the electronic device have been reserved as well as the plastic material being removed.Furthermore,an improved etching solution which was involved with over-saturation Cu2+ was used to decapsulate the electronic device manually.It was showed that the copper wire... |
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| Keywords: | Plastic capsulation Copper wire interconnection Electronic device Decapsulation |
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