| BGA空洞形成的机理及对焊点可靠性的影响 |
| |
| 引用本文： | 王文利,梁永生.BGA空洞形成的机理及对焊点可靠性的影响[J].电子工艺技术,2007,28(3):157-159,162. |
| |
| 作者姓名： | 王文利 梁永生 |
| |
| 作者单位： | 深圳信息职业技术学院信息技术研究所,广东,深圳,518029 |
| |
| 摘 要： | BGA空洞是BGA组装过程常见的工艺缺陷,系统介绍了BGA空洞形成的机理与主要影响因素,讨论了BGA空洞的接受标准及其对焊点可靠性的影响,提出了消除及减少空洞缺陷的主要措施.
|
| 关 键 词： | 空洞 机理 消除 可靠性 |
| 文章编号： | 1001-3474（2007）03-0157-04 |
| 修稿时间： | 2007-03-01 |
Formation Mechanism of BGA Void and Effects on Solder Joint Reliability |
| |
| WANG Wen-li,LIANG Yong-sheng.Formation Mechanism of BGA Void and Effects on Solder Joint Reliability[J].Electronics Process Technology,2007,28(3):157-159,162. |
| |
| Authors: | WANG Wen-li LIANG Yong-sheng |
| |
| Affiliation: | Shenzhen Institute of Information Technology, Shenzhen 518029, China |
| |
| Abstract: | BGA Void is a kind of popular process defects in SMT assembly. Formation mechanism and root causes of BGA voids are introduced. Pass standards of BGA void and BGA void affects on solder joint reliability are discussed. Then troubleshooting solutions for BGA void defect are presented. |
| |
| Keywords: | BGA |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
