| 薄膜与基体间的附着力测试 |
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| 引用本文： | 崔彩娥,缪强,潘俊德.薄膜与基体间的附着力测试[J].电子工艺技术,2005,26(5):294-297. |
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| 作者姓名： | 崔彩娥 缪强 潘俊德 |
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| 作者单位： | 太原理工大学表面工程研究所,山西,太原,030024 |
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| 摘 要： | 薄膜是一种特殊形态的材料,在微电子等领域得到了广泛的应用.薄膜与基体间的附着性能在很大程度上决定了薄膜应用的可能性和可靠性,但是,迄今为止对薄膜与基体间界面的了解还不够深入,也没有一种通用的测量技术.阐述了薄膜与基体间的附着机理和增加附着力的途径,介绍了胶粘法、划痕法等各种比较常用的附着力测试方法.
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| 关 键 词： | 薄膜 基体附着力 测试 |
| 文章编号： | 1001-3474（2005）05-0294-04 |
| 收稿时间： | 2005-08-12 |
| 修稿时间： | 2005年8月12日 |
Measuring of Adhesion Atrength Between Thin Film and Substrate |
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| CUI Cai-e,MIAO Qiang,PAN Jun-de.Measuring of Adhesion Atrength Between Thin Film and Substrate[J].Electronics Process Technology,2005,26(5):294-297. |
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| Authors: | CUI Cai-e MIAO Qiang PAN Jun-de |
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| Affiliation: | Taiyuan University of Technology,Taiyuan 030024 |
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| Abstract: | Thin film is a material in special form that has supported the development of micro -electronics. The possibility and reliability for a film to be applied are depended on the adhesion between film and substrate. So far,the understanding about adhesion is yet insufficient, and there is no measuring method that is common accepted. The main adhesion mechanism is analyzed, some measuring methods that are used in actual are introduced. |
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| Keywords: | Thin film Substrat e Adhesion Measuring |
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