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松香树脂对SnAgCu焊膏性能的影响
引用本文:李涛,赵麦群,薛静,赵阳.松香树脂对SnAgCu焊膏性能的影响[J].电子工艺技术,2009,30(1).
作者姓名:李涛  赵麦群  薛静  赵阳
作者单位:西安理工大学,陕西,西安,710048
摘    要:通过焊膏回流焊接铺展性能及其抗塌落能力测试分析.研究了助焊剂中氢化松香和聚合松香的总含量以及它们的复配比例对SnAgCu焊膏性能的影响.结果表明:当助焊剂中松香质量分数在20%~60%的范围时,增加松香含量可提高焊膏的铺展性能,改善焊点形貌,并显著增强抗塌落能力.当助焊剂中松香总质量分数为40%时,不同松香复配比例的焊膏铺展试验均表现出焊点饱满、表面光亮、周边规则的特征,铺展率基本相当,约为82%,而焊膏的抗塌落性能随聚合松香比例提高而提高.元件试焊表明焊膏具有良好的焊接性能,可用于一般电子产品的焊接.

关 键 词:无铅焊膏  松香  铺展性  抗塌落性  回流焊接

Effects of Rosin Resin on Properties of SnAgCu Solder Paste
LI Tao,ZHAO Mai-qun,XUE Jing,ZHAO Yang.Effects of Rosin Resin on Properties of SnAgCu Solder Paste[J].Electronics Process Technology,2009,30(1).
Authors:LI Tao  ZHAO Mai-qun  XUE Jing  ZHAO Yang
Abstract:The effects of the total content and compound proportions of hydrogenated rosin and polymerized rosin in flux on the properties of SnAgCu lead-free solder paste were studied by test analysis of spreadability and anti-slumping ability.The results indicate that with increasing the content of mixed rosin,the spreading rate increased,the appearance of welding spot was improved,and anti-slumping ability of solder paste was significantly enhanced when the content of mixed rosin between 20wt% and 60wt% in flux.Whe...
Keywords:Lead-free solder paste  Rosin  Spreadability  Anti-slumping ability  Reflow soldering  
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