| 无铅焊接高温对元器件可靠性的影响 |
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| 引用本文： | 王文利,阎焉服,吴波.无铅焊接高温对元器件可靠性的影响[J].电子工艺技术,2008,29(6). |
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| 作者姓名： | 王文利 阎焉服 吴波 |
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| 作者单位： | 1. 深圳信息职业技术学院,信息技术研究所,广东,深圳,518029
2. 河南科技大学,河南,洛阳,471003 |
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| 摘 要： | 介绍无铅工艺焊接高温对元器件可靠性的影响,指出了无铅焊接高温对元器件耐温的挑战,介绍了IPC新标准的无铅器件耐温要求,分析了无铅焊接高温带来的元器件失效问题,如"爆米花"、分层、裂纹等,以及焊接高温对器件内部连接的影响,讨论了通过实施元件热管理来解决无铅焊接高温中的热损伤与热失效的方法,对在无铅焊接工艺过程提高元器件的可靠性应用具有一定的指导意义.
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| 关 键 词： | 无铅 高温 元器件 可靠性 |
Lead-free Soldering High Temperature Influences on Components Reliable Application |
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| WANG Wen-li,YAN Yan-fu,Wu Bo.Lead-free Soldering High Temperature Influences on Components Reliable Application[J].Electronics Process Technology,2008,29(6). |
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| Authors: | WANG Wen-li YAN Yan-fu Wu Bo |
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| Affiliation: | WANG Wen-li,YAN Yan-fu,Wu Bo(1.Shenzhen Institute of Information Technology,Shenzhen 518029,China,2.Henan University of Science , Technology,Luoyang 471003,China) |
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| Abstract: | Lead-free soldering high temperature influences on components reliability are introduced,pointed out that the heat resistant challenge for components under lead-free high temperature process.The IPC new standard of lead free components heat resistance request is introduced,the primary components failure models related with lead-free soldering,like pop-corn,delamination,crack and so on,are analyzed,as well as the soldering high temperature influences on the component internal connection is discussed.Introduc... |
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| Keywords: | Lead-free High temperature Component Reliability |
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