| 无铅波峰焊接工艺的响应曲面优化法优化研究 |
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| 引用本文： | 宋耀宗,李辉,史建卫,王鹏程,杜彬. 无铅波峰焊接工艺的响应曲面优化法优化研究[J]. 电子工艺技术, 2011, 32(1): 4-6,57 |
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| 作者姓名： | 宋耀宗 李辉 史建卫 王鹏程 杜彬 |
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| 作者单位： | 宋耀宗,史建卫,SONG Yao-zong,SHI Jian-wei(日东电子科技(深圳)有限公司,广东,深圳,518103);李辉,LI Hui(哈尔滨工业大学现代焊接生产技术国家重点实验室,黑龙江,哈尔滨,150001);王鹏程,杜彬,WANG Peng-cheng,DU Bin(中国电器科学研究院,广东,广州,510300) |
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| 摘 要： | 利用响应曲面法(RSM)优化无铅波峰焊接工艺,通过前期的部分因子实验设计筛选出了显著因子,分别是助焊剂量、浸锡时间和轨道倾角.实验结果表明:提取的最佳条件是助焊剂量为77.5μg/cm2、浸锡时间为2.3 s和轨道倾角为6.3°.利用最佳操作条件可使波峰焊接缺陷率在10×10-4以下.
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| 关 键 词： | 响应曲面法 无铅波峰焊 工艺优化 |
Process of Lead-free wave soldering optimizing using Response Surface Methodology |
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| SONG Yao-zong,LI Hui,SHI Jian-wei,WANG Peng-cheng,DU Bin. Process of Lead-free wave soldering optimizing using Response Surface Methodology[J]. Electronics Process Technology, 2011, 32(1): 4-6,57 |
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| Authors: | SONG Yao-zong LI Hui SHI Jian-wei WANG Peng-cheng DU Bin |
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| Affiliation: | SONG Yao-zong1,LI Hui2,SHI Jian-wei1,WANG Peng-cheng3,DU Bin3(1.Sun East Electronic Technology Company Lt.d,Shenzhen,518103,China,2.Harbin Institute of Technology,Harbin,150001,3.China National Electric Apparatus Research Institute,Guangzhou,510300,China) |
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| Abstract: | Response surface methodology(RSM) was applied to optimize the process of lead-free wave soldering.The effects of six factors was selected by a factional design,namely the mount of flux,the dwell time,the angle of conveyor.The result of experiment shows that the optimized parameters are follows: the mount of flux is 77.5 μg/cm2,the dwell time is 2.3 s and the angle of conveyor is 6.3°.The defects of lead-free wave soldering under these parameters can be controlled in 10×10-4. |
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| Keywords: | Response Surface Methodology Lead-free Wave Soldering Process Optimization Document Code: A Article ID: 1001-3474(2011)01-0004-04 |
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