| 回流焊工艺中常见缺陷及其防止措施 |
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| 引用本文： | 史建卫,宋耀宗.回流焊工艺中常见缺陷及其防止措施[J].电子工艺技术,2011,32(1):58-61. |
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| 作者姓名： | 史建卫 宋耀宗 |
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| 作者单位： | 日东电子科技(深圳)有限公司,广东,深圳,518103 |
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| 摘 要： | 元器件的微型化和产品的多功能化,驱动了产品安装设计的高密度化和立体化.其特点是焊点越来越密集;焊点尺寸越来越微小;间距越来越细.焊接缺陷是影响电子产品质量的主要因素,针对回流焊接工艺中常见的几种缺陷进行分析,并给出相应的解决措施.
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| 关 键 词： | 无铅化电子组装 回流焊 锡珠 桥连 |
Solder Defects and Solutions in Reflow Soldering Process |
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| SHI Jian-wei,SONG Yao-zong.Solder Defects and Solutions in Reflow Soldering Process[J].Electronics Process Technology,2011,32(1):58-61. |
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| Authors: | SHI Jian-wei SONG Yao-zong |
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| Affiliation: | SHI Jian-wei,SONG Yao-zong(Sun East Electronic Technology Company Lt.d,Shenzhen 518103,China) |
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| Abstract: | With component micromation and product multifunction,the product design three-dimensional assembly and integration.It is of the characteristics of high integration and small size and fine pitch more and more.Solder defects are one of the major factors which have an impact on electronic product quality.Analyze several main solder defects in lead-free reflow soldering process,and put forward corresponding solutions as well. |
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| Keywords: | Lead-free Electronics Assembly Reflow Soldering Solder Bearing Bridging |
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