| PBGA焊点热疲劳寿命的正交试验及回归分析 |
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| 引用本文： | 刘常康,周德俭.PBGA焊点热疲劳寿命的正交试验及回归分析[J].电子工艺技术,1999,20(3):90-93. |
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| 作者姓名： | 刘常康 周德俭 |
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| 作者单位： | 桂林电子工业学院,541004 |
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| 摘 要： | 通过对ＰＢＧＡ焊点形态参数与焊点热疲劳寿命的正交试验，利用大型统计分析软件进行多元线性回归分析，建立起ＰＢＧＡ焊点高度固定，芯片在上焊点高度不固定及芯片在下焊 度不固定三种不同工作条件下形态参数与热疲劳寿命之间的回归多项表式，即ＰＢＧＡ焊点形参数与热疲劳寿命的关系表达式。
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| 关 键 词： | PBGA焊点形态参数 热疲劳寿命 正交试验 回归分析 关系表达式 |
| 修稿时间： | 1998-10-28 |
The Orthogonal Experiment and Regression Analysis of PBGA Solder Joint Thermal Life |
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| Liu Changkang,Zhou Dejian.The Orthogonal Experiment and Regression Analysis of PBGA Solder Joint Thermal Life[J].Electronics Process Technology,1999,20(3):90-93. |
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| Authors: | Liu Changkang Zhou Dejian |
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| Affiliation: | Guilin Institute of Electronic Technology |
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| Abstract: | The orthogonal experiments of PBGA joint shape parameters and thermal fatigue life and the regression analyses are presented to build the regression relations between shape parameters and jiont thermal fatigue life under three different technique conditions.Thermal reliabiloty of PBGA joint shape can be estimated using these relations. Thermal reliabiloty of PBGA joint shape can be estimated using these relations. |
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| Keywords: | PBGA shape parameters of joint Thermal fatigue life Orthogonal experiment Regression analysis Relations |
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