| LTCC多层微波互连基板布局布线设计及制造技术 |
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| 引用本文： | 姜伟卓,严伟,谢廉忠.LTCC多层微波互连基板布局布线设计及制造技术[J].电子工艺技术,2000,21(2). |
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| 作者姓名： | 姜伟卓 严伟 谢廉忠 |
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| 作者单位： | 信息产业部电子14所,南京 210013 |
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| 摘 要： | 采用低温共烧陶瓷 (LTCC)技术制造多层微波互连基板 ,可以研制出高密度的T/R组件。讨论了多层基板中微带线和带状线的结构及其优化设计技术 ,介绍了制造工艺流程和关键工艺难点。
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| 关 键 词： | 低温共烧陶瓷 多层微波互连基板 微带线 带状线 T/R组件 |
Design and Manufacturing Technology of LTCC Multilayer Microwave Substrate |
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| JIANG Wei-zhuo,YAN Wei,XIE Lian-zhong.Design and Manufacturing Technology of LTCC Multilayer Microwave Substrate[J].Electronics Process Technology,2000,21(2). |
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| Authors: | JIANG Wei-zhuo YAN Wei XIE Lian-zhong |
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| Abstract: | The low temperature co-fired ceramic(LTCC) technology has been used in the multilayer substrate in microwave frequency.It can be used to develop the high density T/R modules. In this paper,the structure and its design optimization of microstrip line and stripline in the multilayer substrate are discussed, the manufacturing process and its key technology are also introduced. |
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| Keywords: | Low temperature co-fired ceramic(LTCC) Multilayer substrate in microwave frequency Microstrip line Stripline T/R module |
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