| 电子封装材料用金刚石/铜复合材料的研究进展 |
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| 引用本文： | 尚青亮,陶静梅,徐孟春,李才巨,朱心昆.电子封装材料用金刚石/铜复合材料的研究进展[J].电子工艺技术,2009,30(1). |
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| 作者姓名： | 尚青亮 陶静梅 徐孟春 李才巨 朱心昆 |
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| 作者单位： | 昆明理工大学,云南,昆明,650093 |
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| 摘 要： | 电子技术的快速发展对封装材料的性能提出了更严格的要求.针对封装材料的发展趋势,金刚石/铜复合材料作为新一代的电子封装材料受到了广泛的重视.概述了金刚石/铜复合材料作为封装材料的优良性能及其制备工艺进展,并对其发展方向进行了展望.
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| 关 键 词： | 电子封装 金刚石/铜复合材料 热导率 热膨胀系数 |
Research Progress of Diamond-Cu Composite Material for Electronic Packaging |
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| SHANG Qing-liang,TAO Jing-mei,XU Meng-chun,LI Cai-ju,ZHU Xin-kun.Research Progress of Diamond-Cu Composite Material for Electronic Packaging[J].Electronics Process Technology,2009,30(1). |
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| Authors: | SHANG Qing-liang TAO Jing-mei XU Meng-chun LI Cai-ju ZHU Xin-kun |
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| Affiliation: | Kunming University of Science and Technology;Kunming 650093;China |
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| Abstract: | The rapid development of electronic technology has led to strict requirement for the properties of electronic packaging material.According to the new development of packaging material,diamond/Cu composites as a new generation electronic packaging material has received more and more attention.The favorable characteristics and basic preparation technology of Diamond-Cu composite material for electronic packaging are reviewed.And the tendency to develop Diamond-Cu composite material for electronic packaging is... |
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| Keywords: | Electronic packaging Diamond-Cu composite material Thermal conductivity Coefficient of thermal expansion |
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